Correlation of Accelerated Tests with Human Body Measurements for Flexible Electronics in Wearable Applications

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil, Kartik Goyal, Hyesoo Jang, Vikas Yadav, Wei Liu

Producción científica: Conference contribution

6 Citas (Scopus)

Resumen

The increase in the use of flexible electronics in wearable applications has resulted in an increased focus on the study of movement characteristics of the human body and its impact on electronics under various day-to-day actions. The flexible electronics that are attached to the human body are tested for reliability under various conditions of human activity such as walking, jumping, squats, lunges, and bicep curls. The human body motion data during these different actions were measured using a set of ten Vicon cameras to measure the position, velocity, and accelerations of a standard full-body sensor location of a human body. The reliability model presented in this study uses the angle variations of each joint in the human body for all the five human activities listed above. Statistical analysis on the difference of each joint angle was tested with hypothesis testing strategies with different subjects and with various human body actions as well. Acceleration factor modeling on the reliability of the electronics was carried out using test data of flexible electronics subjected to bending, twisting, stretching, and folding experiments. These experiments are conducted on flexible electronic substrates until failure with in-situ resistance measurements to monitor the changes in the board during each of these experiments. The experimental measurements of the boards were combined with the human body motion data to model the acceleration factor for each of these tests.

Idioma originalEnglish (US)
Título de la publicación alojadaProceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
EditorialIEEE Computer Society
Páginas877-887
Número de páginas11
ISBN (versión digital)9781728197647
DOI
EstadoPublished - jul 2020
Publicado de forma externa
Evento19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020 - Virtual, Orlando, United States
Duración: jul 21 2020jul 23 2020

Serie de la publicación

NombreInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volumen2020-July
ISSN (versión impresa)1936-3958

Conference

Conference19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
País/TerritorioUnited States
CiudadVirtual, Orlando
Período7/21/207/23/20

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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