Acceleration factors for flexible electronics in wearable applications from actual human body measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu

Producción científica: Conference contribution

2 Citas (Scopus)

Resumen

The increase in use of flexible electronics in wearable applications has prompted in analyzing the movement characteristics of human body under various day to day actions. The flexible electronics that are attached on the human body were tested for reliability under various conditions of human activity such as walking, jumping, squats, lunges and bicep curls. The human body motion data during these different actions were measured using a set of ten Vicon cameras to measure the position, velocity and accelerations of a standard full body sensor location of a human body. The reliability model presented in this study uses the angle variations of each joint in the human body for all the five human activities listed above. Statistical analysis on the variation of each joint angles were tested with hypothesis testing strategies with different subjects and with different human body actions as well. Acceleration factor modelling on the reliability of the electronics were carried out using test data of flexible electronics subjected to bending, twisting, stretching and folding experiments. These experiments were conducted on flexible electronics till failure with in-situ resistance measurements to monitor the changes in the board during each of these experiments. The experimental measurements of the boards were combined with the human body motion data to model the acceleration factor for each of these tests.

Idioma originalEnglish (US)
Título de la publicación alojadaASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019
EditorialAmerican Society of Mechanical Engineers (ASME)
ISBN (versión digital)9780791859322
DOI
EstadoPublished - 2019
Publicado de forma externa
EventoASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019 - Anaheim, United States
Duración: oct 7 2019oct 9 2019

Serie de la publicación

NombreASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019

Conference

ConferenceASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019
País/TerritorioUnited States
CiudadAnaheim
Período10/7/1910/9/19

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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