Acceleration factor modeling of flexible electronic substrates from actual human body measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu

Producción científica: Articlerevisión exhaustiva


The use of flexible electronics wearable applications has prompted the need to understand the stresses imposed during human motion for a range of activities. Wearable applications may involve situations in which the electronics may be flexed-to-install, stretched or subjected to thousands cycles of dynamic flexing. In order to develop meaningful test-levels, a better understanding is needed of the use-cases, variance, and the acceleration factors. In this study, the human body motion data for walking, jumping, squats, lunges, and bicep curls were measured using a set of ten Vicon cameras to measure the position, velocity, and accelerations of a standard full-body sensor location of the human body. In addition, reliability data has been gathered on test vehicles subjected to dynamic flexing. Continuous resistance data have been gathered on circuits subjected to dynamic flexing till failure for some of the commonly used trace geometries in electronic circuits. Experimental measurements during the accelerated tests of the boards were combined with the human body motion data to model the acceleration factor for different human activities based on the flexing angles. Human motion for multiple subjects and multiple joints has been correlated to the test levels for the development of acceleration factors. Statistical analysis on the variation of the joint angles with hypothesis testing has been conducted for different subjects and for different human body actions. Acceleration factors models have been developed for walking, jumping, squats, lunges, and bicep curls.

Idioma originalEnglish (US)
Número de artículo041113
PublicaciónJournal of Electronic Packaging, Transactions of the ASME
EstadoPublished - dic 2020
Publicado de forma externa

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering


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