Fabrication of micromachined mold masters for 3-D, high-aspect-ratio cell culturing substrates

Yanzhu Zhao, Xiaosong Wu, Yong Kyu Yoon, Jung Hwan Park, Stephen J. Kennedy, Zvi Schwartz, Barbara D. Boyan, Mark G. Allen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, three approaches to micromachined mold master structures for molding of a wafer-scale bone culturing platform are compared and contrasted. The processes investigated are a silicon deep-reactive ion etching (DRIE) process, an SU-8/polydimethylsiloxane(PDMS) process, and a multi-step SU-8 process. Upon comparison of the advantages and disadvantages of each approach, a wafer-scale implementation of bone cell culturing substrates is successfully demonstrated using the two-step SU-8 process, and successful duplication of hydrogels based on these molds is demonstrated.

Original languageEnglish (US)
Title of host publicationAmerican Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) MEMS
Pages169-175
Number of pages7
StatePublished - 2005
Event2005 ASME International Mecahnical Engineering Congress and Exposition, IMECE 2005 - Orlando, FL, United States
Duration: Nov 5 2005Nov 11 2005

Publication series

NameAmerican Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) MEMS
Volume7 MEMS
ISSN (Print)1096-665X

Other

Other2005 ASME International Mecahnical Engineering Congress and Exposition, IMECE 2005
CountryUnited States
CityOrlando, FL
Period11/5/0511/11/05

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

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  • Cite this

    Zhao, Y., Wu, X., Yoon, Y. K., Park, J. H., Kennedy, S. J., Schwartz, Z., Boyan, B. D., & Allen, M. G. (2005). Fabrication of micromachined mold masters for 3-D, high-aspect-ratio cell culturing substrates. In American Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) MEMS (pp. 169-175). (American Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) MEMS; Vol. 7 MEMS).