TY - GEN
T1 - Correlation of Accelerated Tests with Human Body Measurements for Flexible Electronics in Wearable Applications
AU - Lall, Pradeep
AU - Thomas, Tony
AU - Narangaparambil, Jinesh
AU - Goyal, Kartik
AU - Jang, Hyesoo
AU - Yadav, Vikas
AU - Liu, Wei
N1 - Funding Information:
The project was sponsored by the NextFlex Manufacturing Institute under OPC 1.0 Open Call Project titled – Additive and Semi-Additive Methods for High-Density Interconnects. This material is based, in part, on research sponsored by Air Force Research Laboratory under agreement number FA8650-15-2-5401, as conducted through the flexible hybrid electronics manufacturing innovation institute, NextFlex. The U.S. Government is authorized to reproduce and distribute reprints for Governmental purposes notwithstanding any copyright notation thereon. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of Air Force Research Laboratory or the U.S. Government.
Publisher Copyright:
© 2020 IEEE.
PY - 2020/7
Y1 - 2020/7
N2 - The increase in the use of flexible electronics in wearable applications has resulted in an increased focus on the study of movement characteristics of the human body and its impact on electronics under various day-to-day actions. The flexible electronics that are attached to the human body are tested for reliability under various conditions of human activity such as walking, jumping, squats, lunges, and bicep curls. The human body motion data during these different actions were measured using a set of ten Vicon cameras to measure the position, velocity, and accelerations of a standard full-body sensor location of a human body. The reliability model presented in this study uses the angle variations of each joint in the human body for all the five human activities listed above. Statistical analysis on the difference of each joint angle was tested with hypothesis testing strategies with different subjects and with various human body actions as well. Acceleration factor modeling on the reliability of the electronics was carried out using test data of flexible electronics subjected to bending, twisting, stretching, and folding experiments. These experiments are conducted on flexible electronic substrates until failure with in-situ resistance measurements to monitor the changes in the board during each of these experiments. The experimental measurements of the boards were combined with the human body motion data to model the acceleration factor for each of these tests.
AB - The increase in the use of flexible electronics in wearable applications has resulted in an increased focus on the study of movement characteristics of the human body and its impact on electronics under various day-to-day actions. The flexible electronics that are attached to the human body are tested for reliability under various conditions of human activity such as walking, jumping, squats, lunges, and bicep curls. The human body motion data during these different actions were measured using a set of ten Vicon cameras to measure the position, velocity, and accelerations of a standard full-body sensor location of a human body. The reliability model presented in this study uses the angle variations of each joint in the human body for all the five human activities listed above. Statistical analysis on the difference of each joint angle was tested with hypothesis testing strategies with different subjects and with various human body actions as well. Acceleration factor modeling on the reliability of the electronics was carried out using test data of flexible electronics subjected to bending, twisting, stretching, and folding experiments. These experiments are conducted on flexible electronic substrates until failure with in-situ resistance measurements to monitor the changes in the board during each of these experiments. The experimental measurements of the boards were combined with the human body motion data to model the acceleration factor for each of these tests.
KW - Acceleration factor
KW - Flexible PCB's
KW - Vicon camera
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U2 - 10.1109/ITherm45881.2020.9190514
DO - 10.1109/ITherm45881.2020.9190514
M3 - Conference contribution
AN - SCOPUS:85091792500
T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
SP - 877
EP - 887
BT - Proceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
PB - IEEE Computer Society
T2 - 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
Y2 - 21 July 2020 through 23 July 2020
ER -