Acceleration factors for flexible electronics in wearable applications from actual human body measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

The increase in use of flexible electronics in wearable applications has prompted in analyzing the movement characteristics of human body under various day to day actions. The flexible electronics that are attached on the human body were tested for reliability under various conditions of human activity such as walking, jumping, squats, lunges and bicep curls. The human body motion data during these different actions were measured using a set of ten Vicon cameras to measure the position, velocity and accelerations of a standard full body sensor location of a human body. The reliability model presented in this study uses the angle variations of each joint in the human body for all the five human activities listed above. Statistical analysis on the variation of each joint angles were tested with hypothesis testing strategies with different subjects and with different human body actions as well. Acceleration factor modelling on the reliability of the electronics were carried out using test data of flexible electronics subjected to bending, twisting, stretching and folding experiments. These experiments were conducted on flexible electronics till failure with in-situ resistance measurements to monitor the changes in the board during each of these experiments. The experimental measurements of the boards were combined with the human body motion data to model the acceleration factor for each of these tests.

Original languageEnglish (US)
Title of host publicationASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791859322
DOIs
StatePublished - 2019
Externally publishedYes
EventASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019 - Anaheim, United States
Duration: Oct 7 2019Oct 9 2019

Publication series

NameASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019

Conference

ConferenceASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019
Country/TerritoryUnited States
CityAnaheim
Period10/7/1910/9/19

Keywords

  • Acceleration factor
  • Flexible PCB’s
  • Vicon camera

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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